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Substrate Transport Device - メーカー・企業と製品の一覧

Substrate Transport Deviceの製品一覧

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Through-hole substrate transport device "Float Chuck LNA-S type"

Transport green sheets, through-hole substrates, breathable sheets, and non-woven fabrics without contact.

The non-contact transport device "Float Chuck LNA-S type" suspends and transports ceramic green sheets, through-hole substrates, non-woven fabrics, and breathable sheets without contact by ejecting air. The non-contact transport device "Float Chuck LNA-S type" is equipped with a nozzle that has a mechanism preventing high-speed air flow from directly colliding with the workpiece, allowing for the transport of thin, fragile green sheets with a thickness of 120μm and ultra-thin glass substrates over 50μm in thickness without damage or breakage. Additionally, the non-contact transport device "Float Chuck LNA-S type" has low air consumption and is highly efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets with a thickness of 120μm. 4. Capable of transporting ceramic green sheets without damage. 5. Low air consumption. 6. Does not pollute the environment.

  • Other conveying machines
  • Circuit board processing machine
  • Pneumatic Equipment

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Development Example: "Conveying Device"

It is a conveyor that transports substrates.

Taiyo Acris is committed to developing equipment that accurately meets our customers' needs. To achieve this, we handle everything in-house, including mechanical design, electrical design, software design, parts procurement, assembly, and on-site adjustments. We conduct reviews at each development step to ensure a smooth startup for our customers. 【Equipment Overview】 ○ Equipment for transporting substrates For more details, please contact us or download the catalog.

  • Substrate transport device (loader/unloader)

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Floating-type substrate transfer device

The substrate is set on a porous PE plate! There is no need to flip the substrate even for double-sided inspection.

We would like to introduce our "Floating Type Substrate Transport Device." The material used is ultra-high molecular weight polyethylene (UHMW-PE), with an average pore diameter ranging from Min 2μm to Max 80μm, and a porosity of 35% to 40%. Additionally, it employs a static electricity prevention method that leaks static electricity to the outside through conductive pathways formed in the air holes, with a heat resistance temperature of up to 90°C for continuous use. 【Specifications (Partial)】 ■ Material: Ultra-high molecular weight polyethylene (UHMW-PE) ■ Average pore diameter: Min 2μm to Max 80μm ■ Porosity: 35% to 40% ■ Flatness: 10μm ■ Static electricity prevention method: Leaks static electricity to the outside through conductive pathways formed in the air holes *For more details, please refer to the PDF document or feel free to contact us.

  • Substrate transport device (loader/unloader)

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Substrate transfer device

We provide the optimal "conveying" technology considering accuracy requirements, space, and productivity.

1. Conveying with a conveyor - Achieves the transport of thin films of 0.12mm and large glass of 2,200mm × 2,500mm - Equipped with a high-precision alignment function using a CCD camera, compatible with rotation mechanisms at arbitrary angles 2. Conveying with a stage - Offers a flat stage with a flatness of 20μm and a pin stage effective for static electricity countermeasures - Supports high-precision transport with pitching accuracy of ±0.05° and yawing accuracy of ±0.02° 3. Conveying with SCARA - Capable of designing and manufacturing SCARA transport tailored to limited installation ranges and payloads - Also manufactures transport systems compatible with higher-level communication systems equipped with standard SCARA 4. R2R (Roll to Roll) transport - Continuous feeding and pitch feeding control system for film rolls

  • Other assembly machines

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Raydz Corporation Company Profile

Proposal of solutions in the electronic equipment and semiconductor field! OEM supply from manufacturers with specifications for the Japanese market.

RAYDZ Corporation contributes to strengthening Japan's manufacturing through the production and sale of essential board transport equipment (loaders, unloaders, and various conveyors) for building circuit board assembly lines. Additionally, we offer products that leverage our years of industry experience to support factory automation and solve various challenges. We can provide a wide range of proposals, from assembly-related equipment and materials to energy-saving and environmental improvement products. [Overview of Major Products, Technologies, Products, and Services] ■ In-house brand board transport equipment (loaders, unloaders, various conveyors) ■ Agency sales of insertion machines for irregular parts that contribute to the automation of post-assembly processes ■ Agency sales of various energy-saving products that contribute to factory operations *For more details, please refer to the PDF materials or feel free to contact us.

  • Other conveying machines

ブックマークに追加いたしました

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ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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